plating

英 [ˈpleɪtɪŋ]

美 [ˈpleɪtɪŋ]

n.  镀层(镀在金属上的其他金属薄层); 外层; (尤指)金属板护层
v.  电镀(尤指镀金、镀银); 为…加设护板; (用金属板等)覆盖
plate的现在分词

现在分词：plating　

化学

BNC.25067 / COCA.22601

牛津词典

noun

• 镀层（镀在金属上的其他金属薄层）
  a thin covering of a metal, especially silver or gold, on another metal
• 外层；（尤指）金属板护层
  a layer of coverings, especially of metal plates
  1. armour plating
     装甲敷板

柯林斯词典

• N-UNCOUNT （金属）镀层；外覆的金属板
  Platingis a thin layer of metal on something, or a covering of metal plates.
  1. The tanker began spilling oil the moment her outer plating ruptured.
     油轮外部金属板覆层破裂的那一瞬间，油开始外溢。

英英释义

noun

• the application of a thin coat of metal (as by electrolysis)
• a thin coating of metal deposited on a surface
  Synonym:metal plating

双语例句

• The effects of electroless nickel plating on the particles morphology and the electrochemical properties of low-Co hydrogen storage alloy were investigated.
  研究了化学镀镍对低钴贮氢合金粉末颗粒形态和电化学性能的影响。
• The common electroless processes for plating different metals and alloys on ceramic surface and their pretreatment are presented.
  本文论述了常用的陶瓷表面镀覆不同金属、合金的化学镀及其前处理工艺。
• Because it is a good plating layers of titanium and therefore will never decolorization.
  因为是镀了好几层钛金的，因此永远也不会脱色。
• The progress in research on non-cyanide electroless gold plating is reviewed.
  综述了化学镀金的研究进展。
• In addition, the heat treatment of electroless plating coatings can obviously improve their properties.
  此外，对碳纳米管化学镀层热处理可以改善镀层的性质。
• Influencing factors to the uniformity of coating thickness for alkaline zinc plating have been studied systematically by Hall-cell test.
  采用霍尔槽试验对碱性镀锌镀层厚度均一性的影响因素进行了研究。
• A novel technology of acidic electroless copper plating on steel matrix was studied in this paper.
  研制了一种新型的钢铁基件酸性化学镀铜工艺技术。
• The mechanism of nickel plating effects on the electrochemical properties of low-Co hydrogen storage alloy was discussed.
  分析了镀镍对低钴贮氢合金电化学性能的影响机理。
• Trivalent chromium plating can be divided into chloride and sulfate systems.
  三价铬电镀分为氯化物体系和硫酸盐体系。
• A new copper plating bath for electroless deposition directly on conductive copper-diffusion barrier layers has been developed.
  一种可以直接在传导性铜扩散阻挡层非电镀沉积的新的铜镀液已经被发现了。